Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repair to ease AI's memory bottleneck | Spyke

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Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repair to ease AI's memory bottleneck

The patent was filed 18 months ago, and there's no further indication of ongoing development

Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repair to ease AI's memory bottleneck

https://www.tomshardware.com/tech-industry/semiconductors/intel-patent-reveals-new-xbm-memory-architecture-that-ditches-hbms-costly-silicon-interposer-backend-transistor-dram-stack-uses-ucie-links-and-built-in-repair-to-ease-ais-memory-bottleneckOpen link View original on piefed.social

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Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repair to ease AI's memory bottleneck | Spyke