AMD ‘had to re-engineer’ the Ryzen 7 5800X3D for a re-release — 10th Anniversary Edition chip had ‘a whole body of engineering work’ put into it
cross-posted from: https://lemmy.today/post/55011369
AMD’s David McAfee, VP and general manager of Radeon and Ryzen, says that “a whole body of engineering work” went into the re-release, as the original bonding process TSMC used for the Ryzen 7 5800X3D was no longer available.
[...]
“It completely changed the characteristics of how those two pieces of silicon are bonded together and how they were stacked together, and so when that first-gen facility really kind of went offline, then it meant there was a whole, you know, body of engineering work that had to be done to understand if we could even migrate the 5800X3D to the new, second-generation stacking process,” McAfee said.
Well, a facility that can handle that process going offline explains why the processor stopped being produced even though it's been in high demand for a while.
https://www.tomshardware.com/pc-components/cpus/amd-had-to-re-engineer-the-ryzen-7-5800x3d-for-a-re-release-10th-anniversary-edition-chip-had-a-whole-body-of-engineering-work-put-into-itOpen linkView original on lemmy.today
Surprised to hear that the TSMC node isn't available at all. One would think if they went with all the trouble of porting their design to a different node, they would add something extra for all those of us who are not moving off AM4 in the next 3+ years.